Product Description
It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.
Dimension/Tolerance
| Length | Refer to the right table |
| Width |
| Thickness |
| Surface roughness | Ra <0.4 |
| Warpage | 5.0μm ≦ |
| Edge radius | 20.0μm ≦ |
Metallization
| All surface | Ni 1.0-5.0μm/Au 0.1-0.3μm |
AuSn solder
| Composition | Au70/Sn20±5(wt%) |
| Thickness | 2μm~10μm±20% |
Product Properties:
Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
